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TSMC

Logo: Taiwan Semiconductor Manufacturing Company Limited, Public domain, via Wikimedia Commons5

Taiwanese semiconductor foundry company

Taiwan Semiconductor Manufacturing Company Limited (Chinese: 台灣積體電路製造股份有限公司; Taiwan Semiconductor or TSMC, stylised in all lowercase) is a Taiwanese multinational semiconductor contract manufacturing and design company. Headquartered in Hsinchu Science Park, it was the world's largest non-US company by market capitalisation as of June 30, 2026.3 From Wikipedia, CC BY-SA 4.0

$422.10 down 7.90 (1.84%)Price as of Oct 15, 2026 at 19:45 UTC

Last updated Oct 16, 2026.

Overview

Feb 21, 1987Founded1

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  • TickerTSM on NYSE1
  • Industrysemiconductor industry1
  • HeadquartersHsinchu Science Park1
  • Founded inHsinchu City1
  • Websitewww.tsmc.com
  • Legal formCompany Limited by Shares (Taiwan)1
  • Listed onTaiwan Stock Exchange (2330), New York Stock Exchange (TSM)1
  • Business addressNo. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu6
  • Filer categoryLarge accelerated filer6
TSMC Fab5
Photo: Peellden, CC BY-SA 3.0, via Wikimedia Commons8

Taiwan Semiconductor Manufacturing Company Limited (Chinese: 台灣積體電路製造股份有限公司; Taiwan Semiconductor or TSMC, stylised in all lowercase) is a Taiwanese multinational semiconductor contract manufacturing and design company. Headquartered in Hsinchu Science Park, it was the world's largest non-US company by market capitalisation as of June 30, 2026. It holds a commanding majority in the semiconductor foundry market, accounting for approximately 70% of the global market share. As the leading dedicated contract chipmaker, it serves as the main supplier for Nvidia, Apple, Broadcom, and Qualcomm. The company has grown rapidly due to the artificial intelligence (AI) boom and its importance in the creation of advanced chips needed for AI. Its role as a supply chain bottleneck raises concerns that a disruption could cause another worldwide chip shortage.3

Financials

From the company’s reports to the SEC. Every number links to the filing it came from.

Key numbers, fiscal 2024

56.1%Gross margin9
45.7%Operating margin9
40.0%Net margin9
25.0%Revenue growth, 20249
27.0%Return on equity9
$26.5BFree cash flow9

Where the money goes

Where each dollar of revenue went, fiscal 2024

  • Other costs60¢$53.0B
  • Profit40¢$35.3B

Out of $88.3B in revenue.9

Where each dollar of operating cash went, fiscal 2024

  • Capital spending52¢$29.2B
  • Kept or used elsewhere48¢$26.5B

Out of $55.7B of cash from operations.9

Financial statements

Revenue1011121314159$88.3B in 2024+162% since 2018
0$25.0B$50.0B$75.0B$100.0B2018: $33.7B$33.7B20182019: $35.8B$35.8B2019+6%2020: $47.7B$47.7B2020+33%2021: $57.2B$57.2B2021+20%2022: $73.7B$73.7B2022+29%2023: $70.6B$70.6B2023−4%2024: $88.3B$88.3B2024+25%
Gross profit1011121314159$49.5B in 2024+205% since 2018
0$20.0B$40.0B$60.0B2018: $16.3B$16.3B20182019: $16.5B$16.5B2019+1%2020: $25.3B$25.3B2020+54%2021: $29.5B$29.5B2021+17%2022: $43.9B$43.9B2022+49%2023: $38.4B$38.4B2023−13%2024: $49.5B$49.5B2024+29%
Operating income1011121314159$40.3B in 2024+222% since 2018
0$20.0B$40.0B$60.0B2018: $12.5B$12.5B20182019: $12.5B$12.5B2019−1%2020: $20.2B$20.2B2020+62%2021: $23.4B$23.4B2021+16%2022: $36.5B$36.5B2022+56%2023: $30.1B$30.1B2023−18%2024: $40.3B$40.3B2024+34%
Net income1011121314159$35.3B in 2024+198% since 2018
0$10.0B$20.0B$30.0B$40.0B2018: $11.9B$11.9B20182019: $11.8B$11.8B2019−0%2020: $18.2B$18.2B2020+54%2021: $21.4B$21.4B2021+17%2022: $32.3B$32.3B2022+51%2023: $27.8B$27.8B2023−14%2024: $35.3B$35.3B2024+27%

Every line of the income statement in the latest annual report, as filed.16

Period ending2025-12-312024-12-312023-12-31
NET REVENUE3.8T TWD2.9T TWD2.2T TWD
COST OF REVENUE1.5T TWD1.3T TWD986.6B TWD
GROSS PROFIT2.3T TWD1.6T TWD1.2T TWD
Research and development246.4B TWD204.2B TWD182.4B TWD
General and administrative82.3B TWD83.7B TWD60.9B TWD
Marketing16.9B TWD13.1B TWD10.6B TWD
Total operating expenses345.6B TWD301.1B TWD253.8B TWD
OTHER OPERATING INCOME AND EXPENSES, NET447.3M TWD-1.2B TWD188.7M TWD
INCOME FROM OPERATIONS1.9T TWD1.3T TWD921.5B TWD
Share of profits of associates5.5B TWD4.9B TWD4.8B TWD
Interest Income105.7B TWD87.2B TWD60.3B TWD
Other income591.7M TWD566.9M TWD480.0M TWD
Foreign exchange gain (loss), net13.8B TWD10.0B TWD-2.7B TWD
Finance costs-12.4B TWD-10.5B TWD-12.0B TWD
Other gains and losses, net-7.7B TWD-8.4B TWD7.0B TWD
Total non-operating income and expenses105.6B TWD83.8B TWD57.9B TWD
INCOME BEFORE INCOME TAX2.0T TWD1.4T TWD979.3B TWD
INCOME TAX EXPENSE346.5B TWD248.3B TWD128.3B TWD
NET INCOME1.7T TWD1.2T TWD851.0B TWD
Remeasurement of defined benefit obligation-693.3M TWD144.4M TWD-623.4M TWD
Unrealized gain on investments in equity instruments at fair value through other comprehensive income745.3M TWD5.1B TWD2.0B TWD
Gain (loss) on hedging instruments-31.0M TWD5.0M TWD39.9M TWD
Share of other comprehensive income (loss) of associates-113.2M TWD-69.4M TWD42.6M TWD
Income tax benefit (expense) related to items that will not be reclassified subsequently138.6M TWD-38.9M TWD124.6M TWD
Items that will not be reclassified subsequently to profit or loss:46.4M TWD5.1B TWD1.5B TWD
Exchange differences arising on translation of foreign operations-61.0B TWD64.3B TWD-14.5B TWD
Unrealized gain on investments in debt instruments at fair value through other comprehensive income4.7B TWD1.9B TWD4.1B TWD
Loss on hedging instruments-81.2M TWD-80.2M TWD-74.7M TWD
Share of other comprehensive income (loss) of associates-29.0M TWD283.3M TWD63.9M TWD
Items that may be reclassified subsequently to profit or loss:-56.4B TWD66.5B TWD-10.4B TWD
Other comprehensive income (loss), net of income tax-56.3B TWD71.6B TWD-8.8B TWD
Shareholders of the parent1.7T TWD1.2T TWD851.7B TWD
Non-controlling interests-2.5B TWD-856.3M TWD-712.3M TWD
Shareholders of the parent1.6T TWD1.2T TWD843.8B TWD
Non-controlling interests-2.2B TWD-1.8B TWD-1.5B TWD
Total comprehensive income (loss)1.6T TWD1.2T TWD842.2B TWD
Basic earnings per share (in NT$/USD per share)65.47 TWD44.68 TWD32.85 TWD
Diluted earnings per share (in NT$/USD per share)65.47 TWD44.67 TWD32.85 TWD

Compare TSMC with another company

The story

Founded by Morris Chang on Feb 21, 1987, in Hsinchu City.1

In 1986, Li Kwoh-ting, representing the Executive Yuan, invited Morris Chang to serve as the president of the Industrial Technology Research Institute (ITRI) and offered him a blank cheque to build Taiwan's chip industry. At that time, the Taiwanese government wanted to develop its semiconductor industry, but its high investment and high risk nature made it difficult to find investors. Texas Instruments and Intel turned down Chang. Only Philips was willing to sign a joint venture contract with Taiwan to put up $58 million, transfer its production technology, and license intellectual property in exchange for a 27.6 percent stake in TSMC. Alongside generous tax benefits, the Taiwanese government, through the National Development Fund, Executive Yuan, provided another 48.3 percent of the startup capital for TSMC. 20% of the capital was raised from eight private companies (ranging from Formosa Plastics Group’s 5%, CAPCO’s 5% to Taiyuan Textile’s 1%) which were owned by some of the island's wealthiest families, who owned firms that specialised in plastics, textiles, and chemicals. These wealthy Taiwanese were directly "asked" by the government to invest. The rest of the 4.1% capital came from Taiwan's then ruling party’s investment arm: Kuomintang Central Investment Co.

From the company's onset, TSMC operated primarily as a project of the Taiwanese state, as opposed to a completely private company. Its first CEO was James E. Dykes, who left after a year and Morris Chang became the CEO. Although Philips initially held a 27.5% stake in TSMC, its influence extended beyond financial investment. In addition to capital, Philips played a crucial role by transferring semiconductor manufacturing technology, intellectual property, and patents to TSMC, enabling the company to scale more rapidly. Philips also provided TSMC's first CEO, James E. Dykes, who had previously worked at Philips North America. This partnership represented an early example of the "fab-light" strategy, as Philips gradually reduced its in-house semiconductor manufacturing and relied more on external foundries like TSMC. Over the following decades, Philips steadily divested its stake in TSMC and shifted its primary focus to healthcare technology.

Since then, the company has continued to grow, albeit subject to the cycles of demand. In 2011, the company planned to increase research and development expenditures by almost 39 percent to NT$50 billion to fend off growing competition. The company also planned to expand capacity by 30 percent in 2011 to meet strong market demand. In May 2014, TSMC's board of directors approved capital appropriations of US$568 million to increase and improve manufacturing capabilities after the company forecast higher than expected demand. In August 2014, TSMC's board of directors approved additional capital appropriations of US$3.05 billion.

In 2011, it was reported that TSMC had begun trial production of the A5 SoC and A6 SoCs for Apple's iPad and iPhone devices. According to reports in May 2014, Apple sourced its A8 and A8X SoCs from TSMC. Apple then sourced the A9 SoC with both TSMC and Samsung (to increase volume for iPhone 6S launch) and the A9X exclusively with TSMC, thus resolving the issue of sourcing a chip in two different microarchitecture sizes. As of 2014, Apple was TSMC's most important customer. In October 2014, ARM and TSMC announced a new multi-year agreement for the development of ARM-based 10 nm FinFET processors.

Over the objection of the Tsai Ing-wen administration, in March 2017, TSMC invested US$3 billion in Nanjing to develop a manufacturing subsidiary there.

In 2020, TSMC became the first semiconductor company in the world to sign up for the RE100 initiative, pledging to use 100 percent renewable energy by 2050. TSMC accounts for roughly 5 percent of the energy consumption in Taiwan, even exceeding that of the capital city Taipei. This initiative was thus expected to accelerate the transformation to renewable energy in the country. For 2020, TSMC had a net income of US$17.60 billion on a consolidated revenue of US$45.51 billion, an increase of 57.5 percent and 31.4 percent respectively from the 2019 level of US$11.18 billion net income and US$34.63 billion consolidated revenue. Its market capitalisation was over $550 billion in April 2021. TSMC's revenue in the first quarter of 2020 reached US$10 billion, while its market capitalisation was US$254 billion. TSMC's market capitalisation reached a value of NT$1.9 trillion (US$63.4 billion) in December 2010. It was ranked 70th in the FT Global 500 2013 list of the world's most highly valued companies with a capitalisation of US$86.7 billion, while reaching US$110 billion in May 2014. In March 2017, TSMC's market capitalisation surpassed that of semiconductor giant Intel for the first time, hitting NT$5.14 trillion (US$168.4 billion), with Intel's at US$165.7 billion. On 27 June 2020, TSMC briefly became the world's 10th most valuable company, with a market capitalisation of US$410 billion.

To mitigate business risks in the event of war between Taiwan and the People's Republic of China, since the beginning of the 2020s, TSMC has expanded its geographic operations, opening new fabs in Japan and the United States, with further plans for expansion into Germany. In July 2020, TSMC confirmed it would halt the shipment of silicon wafers to Chinese telecommunications equipment manufacturer Huawei and its subsidiary HiSilicon by 14 September. In November 2020, officials in Phoenix, Arizona in the United States approved TSMC's plan to build a $12 billion chip plant in the city. The decision to locate a plant in the US came after the Trump administration warned about the issues concerning the world's electronics made outside of the U.S. In 2021, news reports claimed that the facility might be tripled to roughly a $35 billion investment with six factories. See TSMC § Arizona for more details.

In June 2021, following nearly a year of public controversy surrounding its COVID-19 vaccine shortage, with only about 10 percent of its 23.5 million population vaccinated; Taiwan agreed to allow TSMC and Foxconn to jointly negotiate purchasing COVID-19 vaccines on its behalf. In July 2021, BioNTech's Chinese sales agent Fosun Pharma announced that the two technology manufacturers had reached an agreement to purchase 10 million BioNTech COVID-19 vaccines from Germany. TSMC and Foxconn pledged to each buy five million doses for up to $175 million, for donation to Taiwan's vaccination programme.

Read the full text

Due to the 2020–2023 global semiconductor shortage, Taiwanese competitor United Microelectronics raised prices approximately 7–9 percent, and prices for TSMC's more mature processors were raised by about 20 percent. In November 2021, TSMC and Sony announced that TSMC would be establishing a new subsidiary named Japan Advanced Semiconductor Manufacturing (JASM) in Kumamoto, Japan. The subsidiary manufactures 22- and 28-nanometre processes. The initial investment was approximately $7 billion, with Sony investing approximately $500 million for a less than 20 percent stake. Construction of the fabrication plant started in 2022, with production beginning two years later in 2024.

In February 2022, TSMC, Sony Semiconductor Solutions, and Denso announced that Denso would take a more than 10 percent equity stake in JASM with a US$0.35 billion investment, amid a scarcity of chips for automobiles. TSMC will also enhance JASM's capabilities with 12/16 nanometre FinFET process technology in addition to the previously announced 22/28 nanometre process and increase monthly production capacity from 45,000 to 55,000 12-inch wafers. The total capital expenditure for JASM's Kumamoto fab is estimated to be approximately US$8.6 billion. The Japanese government wants JASM to supply essential chips to Japan's electronic device makers and auto companies as trade friction between the United States and China threatens to disrupt supply chains. The fab is expected to directly create about 1,700 high-tech professional jobs.

In July 2022, TSMC announced the company had posted a record profit in the second quarter, with net income up 76.4 percent year-over-year. The company saw steady growth in the automotive and data centre sectors with some weakness in the consumer market. Some of the capital expenditures are projected to be pushed up to 2023. In the third quarter of 2022, Berkshire Hathaway disclosed purchase of 60 million shares in TSMC, acquiring a $4.1 billion stake, making it one of its largest holdings in a technology company. However, Berkshire sold off 86.2 percent of its stake by the next quarter citing geopolitical tensions as a factor. In February 2024, TSMC shares hit a record high, with the high on the trading day reaching NT$709 and closing at NT$697 (+8%). This was influenced by the increase in the price target on chip designer Nvidia. TSMC currently manufactures 3-nanometre chips and plans to start 2-nanometre mass production in 2025. It is included in the FTSE4Good Index, being the only Asian company in the top ten.

In October 2024, TSMC informed the United States Department of Commerce about a potential breach of export controls in which one of its most advanced chips was sent to Huawei via another company with ties to the Chinese government.

In June 2025, TSMC announced the establishment of the TSMC-UTokyo Lab (TSMC-University of Tokyo Laboratory), marking its first joint research laboratory with an overseas university. In August 2025, TSMC reported that two current employees and six former employees had illegally acquired trade secrets related to the company's leading 2nm process. One of them went on to work for Tokyo Electron, a partner of Japan's semiconductor effort Rapidus, but has since been terminated. A number of suspects have been arrested by Taiwanese authorities.

In January 2026, reported a 35% increase in fourth-quarter profit. This is higher than previous estimates, hitting a fresh record as demand for artificial intelligence chips remained strong.

In April 2026, TSMC introduced its A13 process technology at its North America Technology Symposium. The company described A13 as a direct shrink of its A14 process announced in 2025, stating that it enables more compact and efficient designs to address demand for next-generation artificial intelligence, high-performance computing (HPC), and mobile applications. TSMC also stated that A13 provides 6% area savings compared with A14, while maintaining full backward compatibility with A14 designs rules, allowing customers to migrate designs to its latest nanosheet transistor technology.

In May 2026, TSMC announced plans to sell up to 152 million shares in Vanguard International Semiconductor (VIS) through block trade to institutional investors. The company stated that the sale would reduce its ownership in VIS from approximately 27.1% to about 19% on a fully diluted basis. TSMC said the transaction was intended to allow it to concentrate resources on its core business operations and added that it did not intend to sell additional VIS shares in the near future. The company also stated that the sale would not affect its strategic collaborations with VIS, including outsourcing interposer production and licensing gallium nitride (GaN) technology.

In July 2026, Reuters reported that TSMC posted a 77% year-on-year increase in second-quarter profit to a record NT$706.6 billion (US$22 billion), exceeding analysts' expectations. Reuters reported that the company raised its 2026 capital expenditure forecast to between US$60 billion and US$64 billion, compared with previous guidance of US$52billion to US$56 billion, citing continued strong demand for artificial intelligence chips. Reuters also reported that TSMC increased its forecast for full-year 2026 revenue growth to slightly more than 40% in U.S. dollar terms, up from its previous forecast of more than 30%.

Patent dispute with GlobalFoundries

On 26 August 2019, GlobalFoundries filed several patent infringement lawsuits against TSMC in the US and Germany claiming that TSMC's 7 nm, 10 nm, 12 nm, 16 nm, and 28 nm nodes infringed 16 of its patents. GlobalFoundries named twenty defendants. TSMC said that it was confident that the allegations were baseless. On 1 October 2019, TSMC filed patent infringement lawsuits against GlobalFoundries in the US, Germany and Singapore, claiming that GlobalFoundries' 12 nm, 14 nm, 22 nm, 28 nm and 40 nm nodes infringed 25 of its patents. On 29 October 2019, TSMC and GlobalFoundries announced a resolution to the dispute, agreeing to a life-of-patents cross-license for all of their existing semiconductor patents and new patents for the next 10 years. GlobalFoundries CEO Thomas Caulfield said the agreement "enables both of our companies to focus on innovation and to better serve our clients around the world".

From Wikipedia’s article on TSMC, shared under CC BY-SA 4.0.7

Leadership

Who has led TSMC, and when. Pick a name to see everywhere that person has worked.

Products and brands

  • central processing unit
  • semiconductor device fabrication

Listed on Wikidata.1

Technologies

TSMC's N7+ is the first commercially available extreme-ultraviolet lithographic process in the semiconductor industry. It uses ultraviolet patterning and enables more acute circuits to be implemented on the silicon. N7+ offers a 15–20 percent higher transistor density and 10 percent reduction in power consumption than previous technology. The N7 achieved the fastest ever volume time to market, faster than 10 nm and 16 nm. The N5 iteration doubles transistor density and improves performance by an additional 15 percent.

In late 2022, TSMC began volume production of its 3 nm process (N3), which provides up to a 70% increase in logic density and a 15% speed improvement over the 5 nm generation. By late 2025, the company transitioned to its 2 nm technology (N2), marking a major architectural shift from FinFET to Gate-All-Around (GAA) nanosheet transistors. The N2 node offers a 10 to 15% performance boost or a 25 to 30% reduction in power consumption compared to the enhanced 3 nm (N3E) process, while increasing chip density by more than 15%.

Production capabilities

On 300 mm wafers, TSMC has silicon lithography on node sizes:

0.13 μm (130 nm, options: general-purpose (G), low-power (LP), high-performance low-voltage (LV))

Read the full text

90 nm (based upon 80GC from Q4/2006)

65 nm (options: general-purpose (GP), low-power (LP), ultra-low power (ULP, LPG))

55 nm (options: general-purpose (GP), low-power (LP))

40 nm (options: general-purpose (GP), low-power (LP), ultra-low power (ULP))

28 nm (options: high-performance (HP), high-performance mobile (HPM), high-performance computing (HPC), high-performance low-power (HPL), low-power (LP), high-performance computing Plus (HPC+), ultra-low power (ULP) with HKMG)

22 nm (options: ultra-low power (ULP), ultra-low leakage (ULL))

20 nm

16 nm (options: FinFET (FF), FinFET Plus (FF+), FinFET Compact (FFC))

12 nm (options: FinFET Compact (FFC), FinFET Nvidia (FFN)), enhanced version of 16 nm process

10 nm (options: FinFET (FF))

7 nm (options: FinFET (FF), FinFET Plus (FF+), FinFET Pro (FFP), high-performance computing (HPC))

6 nm (options: FinFET (FF), risk production started in Q1 2020, enhanced version of 7 nm process)

5 nm (options: FinFET (FF))

4 nm (options: FinFET (FF), risk production started in 2021, enhanced version of 5 nm process)

3 nm (options: FinFET (FF), volume production started in Q4 2022)

It also offers "design for manufacturing" (DFM) customer services. In press publications, these processes will often be referenced, for example, for the mobile variant, simply by 7nmFinFET or even more briefly by 7FF. At the beginning of 2019, TSMC was advertising N7+, N7, and N6 as its leading edge technologies. As of June 2020, TSMC is the manufacturer selected for production of Apple's 5 nanometre ARM processors, as "the company plans to eventually transition the entire Mac lineup to its Arm-based processors, including the priciest desktop computers". In July 2021, both Apple and Intel were reported to be testing their proprietary chip designs with TSMC's 3 nm production.

Facilities

Central Taiwan Science Park

The investment of US$9.4 billion to build its third 300mm wafer fabrication facility in Central Taiwan Science Park (Fab 15) was originally announced in 2010. The facility was expected to manufacture over 100,000 wafers a month and generate US$5 billion per year of revenue. TSMC has continued to expand advanced 28 nm manufacturing capacity at Fab 15. On 12 January 2011, TSMC announced the acquisition of land from Powerchip Semiconductor for NT$2.9 billion (US$96 million) to build two additional 300mm fabs (Fab 12B) to cope with increasing global demand.

Germany

In August 2023, being Maria Marced EMEA President, TSMC committed €3.5 billion to a €10+ billion factory in Dresden, Germany. The plant is subsidised with €5 billion from the German government. Three European companies (Robert Bosch GmbH, Infineon Technologies, and NXP Semiconductors) invested in the plant in return for a 10 percent share each. The resulting joint venture with TSMC is named European Semiconductor Manufacturing Company (ESMC). The factory is planned to be fully operational in 2029 with a monthly capacity of 40,000 12-inch wafers. One wing of the building will be dedicated to 28 nm process, while the other to 12 and 16 nm FinFET - notably, the facility will not be able to use EUV process as ASML's EUV scanners are too tall for the building.

Facility broke ground in August 2024. Construction of the office buildings was finished in January 2026, at that time the main fab's foundation slab and basements were also completed, with the ongoing work on the fab itself and the auxiliary buildings. According to the ESMC President Christian Koitzsch, by June 2026 construction was on-schedule, with the plans to make the fab water-tight and install the first machine by the end of 2026, while the first office workers will move in by mid-2027.

Japan

In November 2021, TSMC and Sony announced that TSMC would be establishing a new subsidiary named Japan Advanced Semiconductor Manufacturing (JASM) in Kumamoto, Japan. Denso and Toyota have also invested in the company and are minor shareholders.

The first factory (Fab 23) in Kikuyo, began commercial operations in December 2024 and produces 12-, 22-, and 28-nanometre processes. Fab 23 cost US$8.6 billion to build, with 476 billion yen subsidised by the Ministry of Economy, Trade and Industry (METI).

The second factory, currently under construction adjacent to Fab 23 as of January 2025, will produce 6-nanometre and 12-nanometre processes. This factory is estimated to cost US$13.9 billion, with 732 billion yen funded by the METI.

Arizona

In 2020, TSMC announced a planned fab in Phoenix, Arizona with a $12 billion investment which intended to begin production by 2024. At launch it was the most advanced fab in the United States. TSMC claimed the plant will create 1,900 full-time jobs.

In December 2022, TSMC announced its plans to triple its investment in the Arizona plants in response to the growing tensions between the US and China and the supply chain disruption that has led to chip shortages. In that same month, TSMC stated that it was running into major cost issues, because the cost of construction of buildings and facilities in the US is four to five times what an identical plant would cost in Taiwan, as well as difficulty finding qualified personnel. These additional production costs will increase the cost of TSMC's chips made in the US to at least 50 percent more than the cost of chips made in Taiwan. In July 2023 TSMC warned that US talent was insufficient, so Taiwanese workers will need to be brought in for a limited time, and that the chip factory will not be operational until 2025. In September 2023, an analyst said the chips will still need to be sent back to Taiwan for packaging. In January 2024, TSMC chairman Liu again warned that Arizona lacked workers with the specialised skills to hire and that TSMC's second Arizona plant likely will not start volume production of advanced chips until 2027 or 2028.

In April 2024, the Biden administration announced a preliminary agreement to award TSMC Arizona up to $6.6 billion in direct funding under the CHIPS and Science Act, alongside up to $5 billion in proposed loans, to support TSMC's planned investment of more than $65 billion across three fabrication plants in Phoenix, which would represent the largest foreign direct investment in a greenfield project in US history. In November 2024, the Commerce Department finalised the binding $6.6 billion CHIPS Act award — the first major award completed under the $52.7 billion programme. TSMC also agreed to use its most advanced "A16" manufacturing technology in Arizona and committed to forgo stock buybacks for five years under an "upside sharing agreement" with the US government.

In July 2025, Wei indicated that TSMC would speed up its production timelines toward the completion of a "gigafab" cluster totalling six facilities after an additional $100 billion investment in Arizona.

In July 2026, TSMC announced an additional US$100 billion investment in its United States manufacturing operations, increasing its total planned investment in the country to US$265 billion. The company's current and planned Arizona operations were expected to comprise twelve semiconductor fabrication and advanced-packaging facilities, together with a research-and-development centre. Its first Arizona fabrication plant was operational, while the second was preparing to begin equipment installation.

Washington

TSMC Washington is a subsidiary of TSMC based in Camas, Washington, 32 km (20 mi) outside Portland, Oregon. The 105 ha (260 acres) campus contains a 9.3 ha (23 acres) complex consisting of a 12,000 m2 (130,000 sq ft) 200mm wafer fabrication plant. TSMC Washington (originally known as WaferTech) was established in June 1996 as a joint venture between TSMC, Altera, Analog Devices, and ISSI. The companies along with minor individual investors placed US$1.2 billion into this venture, which was at the time the single largest startup investment in the state of Washington. The facility started production in July 1998 with its first product being a 0.35 micrometre part for Altera. TSMC bought out the stake of the other partners in 2000, turning the company into a fully owned subsidiary of TSMC. As of 2024, the facility employs 1100 workers and supports node sizes of 0.35, 0.30, 0.25, 0.22, 0.18, and 0.16 micrometres, with an emphasis on embedded flash process technology.

From Wikipedia’s article on TSMC, shared under CC BY-SA 4.0.7

Subsidiaries and ownership

Subsidiaries

  • Taiwan Semiconductor Manufacturing Company (China)
  • Taiwan Semiconductor Manufacturing Company (United States)

Also owns

  • Japan Advanced Semiconductor Manufacturing
  • Systems on Silicon Manufacturing Company Pte. Ltd.

From Wikidata.1

Employees over time

TSMC employees by year165.2K in 2021+36% since 2017
020.0K40.0K60.0K80.0K2017: 48.0K48.0K20172020: 56.8K56.8K2020+18%2021: 65.2K65.2K2021+15%
  • 202165,1521
  • 202056,8311
  • 201748,0001

Timeline

  1. Oct 20, 1997Went public Listed on NYSE1
  2. Sep 5, 1994Went public Listed on Taiwan Stock Exchange1
  3. Feb 21, 1987Founded Founded in Hsinchu City1

Recent filings

  1. Oct 8, 20264
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  9. Oct 8, 20266-K
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  13. Oct 8, 20264
  14. Oct 8, 20264
  15. Oct 8, 20264

Every filing from the last three years, summarized. The full record is on SEC EDGAR.2