The story
In January 2009, HDBaseT products were first demonstrated at the Consumer Electronics Show in Las Vegas.
In September 2015, Valens won the Technology & Engineering Emmy Award, given by the National Academy of Television Arts and Sciences (NATAS) for outstanding achievement in the development and Standardization of HDBaseT Connectivity Technology for Commercial and Residential HDMI/DVI Installations.
In January 2016, Valens announced its intention to branch out and offer its chipsets to the automotive market, partnering with General Motors, Delphi Automotive, and Daimler AG.
In June 2017, Valens introduced the VA6000 chipset family for automotive applications. The VA6000 uses the principle of multi-format aggregation over a single unshielded twisted pair cable with a length of up to 15 meters. The chipsets are integrated in the Mercedes-Benz S-Class, which was launched in September 2020.
In June 2019, the HDBaseT Alliance announced Spec 3.0, which maintained all the features of Spec 2.0 and increased bandwidth over the HDBaseT link to support uncompressed HDMI 2.0 (4K@60 4:4:4), 1Gbps Ethernet, and enhanced USB performance. Valens introduced the VS3000 Stello in June 2019 as well – a chipset family compliant with the HDBaseT Spec 3.0.
In June 2019, the MIPI Alliance announced that Valens’ technology was selected as the foundation for its Automotive Physical Layer standard (A-PHY). The standard will be used by the automotive industry to provide high-speed links for cameras, radars, LiDARs and displays for advanced driver-assistance systems and autonomous driving systems. A-PHY was adopted by the IEEE in July 2021.
From Wikipedia’s article on Valens Semiconductor, shared under CC BY-SA 4.0.6